JPH064634Y2 - 電子回路装置 - Google Patents
電子回路装置Info
- Publication number
- JPH064634Y2 JPH064634Y2 JP1988026616U JP2661688U JPH064634Y2 JP H064634 Y2 JPH064634 Y2 JP H064634Y2 JP 1988026616 U JP1988026616 U JP 1988026616U JP 2661688 U JP2661688 U JP 2661688U JP H064634 Y2 JPH064634 Y2 JP H064634Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic substrate
- metal plate
- circuit device
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 73
- 229910052751 metal Inorganic materials 0.000 claims description 73
- 239000000758 substrate Substances 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 230000008646 thermal stress Effects 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 229910001369 Brass Inorganic materials 0.000 description 5
- 239000010951 brass Substances 0.000 description 5
- 229910000833 kovar Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009954 braiding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026616U JPH064634Y2 (ja) | 1988-02-29 | 1988-02-29 | 電子回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988026616U JPH064634Y2 (ja) | 1988-02-29 | 1988-02-29 | 電子回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130592U JPH01130592U (en]) | 1989-09-05 |
| JPH064634Y2 true JPH064634Y2 (ja) | 1994-02-02 |
Family
ID=31248405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988026616U Expired - Lifetime JPH064634Y2 (ja) | 1988-02-29 | 1988-02-29 | 電子回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064634Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7523688B2 (ja) * | 2021-05-17 | 2024-07-26 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55127044A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Electric circuit substrate and its manufacture |
-
1988
- 1988-02-29 JP JP1988026616U patent/JPH064634Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01130592U (en]) | 1989-09-05 |
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